Zth-Messtechnik Kiffe was founded on March 01, 2018 as a sole proprietorship. The owner has a 20-year experience in thermal measuring technology in
the field of power electronics. Location of the company is Kirchheim near Munich (Germany).
The main field of activity is the measurement of the transient thermal impedance (Zth) of power semiconductors and cooling systems. Another focus is the
development of thermal-electrical simulation software on the basis of measurements (Zth-measurement including coupling, switching loss measurement,
forward voltage loss measurement) for the module and inverter development, keyword: "digital twin".
Zth-Messtechnik Kiffe offers the following services:
- Standard-Zth-measurement on semiconductor devices (Si, SiC) with a load current up to 1000A
(for a correct calculation of the thermal behavior in the simulation), example
- Extended Zth-measurement with determination of R and Tau in the small time ranges,
- Zth-measurement on semiconductor devices (Si, SiC) with different heat transfer fluids,z. B. water/glycol mixture, perfluoropolyether (PFPE), synthetic hydrocarbon (PAO), example
- Thermal characterization of interface materials (pastes / foils / DCB / IMS), example
- Transient thermal-electrical simulation software for 2-level- and 3-level-NPC1-inverter, control: internally about under-
shoot method, externally over gate pattern-file, load: LR-load or 3-phases asynchronous motor with slippage, motor operation,
For wishes, suggestions and inquiries, please contact me by email.Publications:M. Stoisiek, M. Beyer, W. Kiffe, H-J. Schultz, H. Schmid, H. Schwarzbauer, R. Stengl,P. Türkes, D. Theis: A Large Area MOS-GTO with Wafer-Repair Technique,Tech. Digest IEDM-1987, 29.3 (666ff)M. Stoisiek, H. Schwarzbauer, W. Kiffe, D. Theis:2000-A/1-m Omega power MOSFETs in wafer repair technique,June 1990,IEEE Transactions on Electron Devices 06/1990; 37(5-37):1397 - 1401, DOI:10.1109/16.108203Y. Jin, K. Hoffmann, W. Kiffe "A forward recovery model of power diodes"Proc of European Power Electronics Conf, 1991, pp.339-342P. Türkes, W. Kiffe, R. Kuhnert:Critical switching condition of a non-punch-through IGBT investigated by electrothermalcircuit simulation, January 1994, Power Semiconductor Devices and ICs, 1994. ISPSD '94.Proceedings of the 6th International Symposium on; 01/1994, DOI:10.1109/ISPSD.1994.583644T. Laska, A. Porst, H. Brunner, W. Kiffe:Low loss/highly rugged IGBT-generation - based on a self aligned process with doubleimplanted N/N+-emitter, January 1994, Power Semiconductor Devices and ICs, 1994. ISPSD '94.Proceedings of the 6th International Symposium on; 01/1994, DOI:10.1109/ISPSD.1994.583694B. Fiegl, M. Hibler, W. Kiffe, F. Koch, R. Kuhnert, R. Messer, H. Schwarzbauer, (1994)"Application of Diamond in Power Device Modules", Microelectronics International,Vol. 11 Issue: 3, pp.15-17,N.Seliger, J. Rackles, H. Schwarzbauer, W. Kiffe, S. Bolz: Compact and RobustPower Electronics Packaging and Interconnection Technology for an IntegratedStarter Generator, Haus der Technik Fachbuch Band 14, Expert-Verlag, Essen 2002G. Mitic, W. Kiffe, G. Lefranc, S. Ramminger: Comparison of spray cooling withdirect liquid base-plate flow convection of IGBT power modules,EPE-PEMC 2002, Cavtat & DubrovnikG. Mitic, W. Kiffe, G. Lefranc, S. Ramminger, D.E. Tilton, B.A. Smetana, T.D. Weir:Spray cooling of IGBT electronic power modules. Thermal Challenges in Next GenerationElectronic Systems, Joshi & Garimella, Millpress, Rotterdam, ISBN 90-77017-03-8, 2002Y.C. Gerstenmair, W. Kiffe, G. Wachutka, „Combination of Thermal SubsystemsModeled by Rapid Circuit Transformation,“ in Proc. of Thermal Investigation of ICsand Systems (THERMINIC), Budapest, 2007, pp. 115-120.T. Komma, W. Kiffe:Dynamic junction temperature calculation and measurement by Four-pole theory and complex Fourier-Series2009 13th European Conference on Power Electronics and Applications2009 13th European Conference on Power Electronics and ApplicationsK. Kriegel, T. Komma, W. Kiffe, J. Otto, S. Levchuk:Influence of baseplate design on cooling performance and reliabilityConference: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems03/06/2012 - 03/08/2012 at Nuremberg, GermanyKeywords:
Measurement Rth Zth Thermal Management Transient Thermal Impedance Heat Thermal Resistance Thermal Management Heat Dissipation Heating Curve Cooling Curve Heat Sink Cooling Water Cooling Open Closed Water Cooler Heatpipes Glycol Galden perfluoropolyether (PFPE) synthetic hydrocarbon (PAO) Assembly and Bonding Technology Partialbruch Cauer Forster transformation Network Continuous Chain Power Electronics Measurement Reliability Lifetime Modeling Thermal Interface Thermal Compound Graphite IMS IGBT MOSFET Siliciumcarbid Diode Thyristor Triac Automotive Hybrid Drive Hybrid Vehicle Electric Car Digital Twin Simulation Module Inverter Development 2-level 3-level NPC1 Inverter Inverter Inverter Asynchronous Motor Drive train Passage Measurement Characteristic Double Pulse Switching SSR SSC Solid State Relays